LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Low voltage drop and high thermal performance ball grid...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Low warpage flip chip package solution-channel heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Low-capacitance bonding pad for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Low-cost circuit board materials and processes for area...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Low-cost flexible film package module and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Low-impedance surface-mount device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Low-inductance circuit arrangement for power semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Low-inductance power semiconductor module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Low-inductance semiconductor components

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Low-pin-count chip package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Low-pin-count chip package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Low-pin-count chip package having concave die pad and/or...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Low-profile ball-grid array semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Low-temperature calcined ceramics

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Lower profile package with power supply in package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

LSI package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

LSI package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

LSI package board

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

LSI package provided with interface module, and transmission...