Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1994-11-02
1996-07-30
Limanek, Robert P.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257738, 257777, 257780, H01L 2348, H01L 2352
Patent
active
055414508
ABSTRACT:
A ball-grid array (BGA) semiconductor package (10,60,90) includes a substrate (31,61,91) attached to a support substrate (32,62 92). The substrate (31,61,91) has an opening (33) extending from an upper surface to a lower surface. An integrated circuit chip (18) is attached to the support substrate (32,62,92) within the opening (33). Bond pads (22) on the integrated circuit chip (18) are electrically connected to ball pads (42,73,106,108) on the lower surface of the substrate (31,61,91). Conductive solder balls (26) are attached to the ball pads (42,73,106,108). The support substrate (32,62,92) provides a low profile and functions as a standoff that limits the collapse of the conductive solder balls (26) when the BGA semiconductor package (10,60,90) is attached to an application board (46).
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Baird John
Jones Tim
Ommen Denise
Hardy David B.
Jackson Kevin B.
Limanek Robert P.
Motorola Inc.
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