Low thermal resistance spring biased RF semiconductor package mo

Details Low thermal resistance spring biased RF semiconductor package mo Low thermal resistance spring biased RF semiconductor package mo

1996-09-30

1998-10-20

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257719, 257726, 257727, 361710, 361711, 361719, H01L 2334

Patent

active

058250891

ABSTRACT:
A ceramic package and mounting structure which requires less surface area on a heat sink and improves heat transfer to the heat sink. Each ceramic package has a top side and a bottom side with the bottom side being flat and smooth. The bottom side can be a polished ceramic, or metal layer which is plated or brazed to the bottom side. The mounting structure includes a clamp and a spring in pressure engagement with the top side of the package for maintaining the package in pressure engagement with the heat sink.

REFERENCES:
patent: 3636415 (1972-01-01), Kruer
patent: 3777238 (1973-12-01), Rabut
patent: 4141028 (1979-02-01), Hulstrunk
patent: 4259685 (1981-03-01), Romano
patent: 4649460 (1987-03-01), Marchisi et al.
patent: 4672422 (1987-06-01), Schierz
patent: 4768352 (1988-09-01), Maruyama
patent: 4965658 (1990-10-01), Norbeck et al.

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