Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-09-19
2006-09-19
Soward, Ida M. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S686000, C257S688000, C257S689000, C257S700000, C257S723000, C257S729000, C257S730000, C257S731000, C257S773000, C257SE23055, C257SE23065, C257SE23177
Reexamination Certificate
active
07109575
ABSTRACT:
Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package module for specific applications. The lower-cost flexible film package module includes a tape film that combines both a first insulating substrate, typically formed from a higher-cost polyimide material, and a second insulating substrate, typically formed from an insulating material or materials that are less expensive and/or provide modified performance when compared with the first insulating material. Both the first and second substrates will include complementary circuit patterns that will be electrically and physically connected to allow the composite substrate to function as a unitary substrate. The first and second substrates will also include connection regions that may be adapted for connection to printed circuit boards and/or electronic devices such as liquid crystal displays.
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Korean Office Action Jul. 25, 2005 for Korean Application No. 10-2003-0054221 (w/full English translation).
Korean Office Action dated Jan. 17, 2006 with translation.
Chung Ye-Chung
Kang Sa-Yoon
Kim Dong-Han
Harness & Dickey & Pierce P.L.C.
Soward Ida M.
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