Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2005-05-03
2005-05-03
Pham, Hoai (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
Reexamination Certificate
active
06888238
ABSTRACT:
A semiconductor package includes a chip carrier to receive a semiconductor with a dimension generally greater than 22 mm. The chip carrier has a first coefficient of thermal expansion that is larger than the coefficient of thermal expansion of the semiconductor. A heat spreader having parallel channels on opposite sides is attached to the chip carrier along the channels. The heat spreader has a second coefficient of thermal expansion that is smaller than or equal to the coefficient of thermal expansion of the chip carrier. The interplay between the heat spreader and the chip carrier can effectively reduce package warpage and maintain coplanarity within the specification.
REFERENCES:
patent: 3958195 (1976-05-01), Johnson
patent: 4891686 (1990-01-01), Krausse, III
patent: 5905636 (1999-05-01), Baska et al.
patent: 6118177 (2000-09-01), Lischner et al.
patent: 6294408 (2001-09-01), Edwards et al.
patent: 6410988 (2002-06-01), Caletka et al.
patent: 6433412 (2002-08-01), Ando et al.
patent: 6631077 (2003-10-01), Zuo
patent: 20040070069 (2004-04-01), Subramanian
Altera Corporation
Ha Nathan W.
Morgan & Lewis & Bockius, LLP
Pham Hoai
LandOfFree
Low warpage flip chip package solution-channel heat spreader does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Low warpage flip chip package solution-channel heat spreader, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low warpage flip chip package solution-channel heat spreader will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3427920