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Integrated circuit package with external storage capacitor for i

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Integrated circuit package with flat-topped heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Integrated circuit package with improved electro-static...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Integrated circuit package with improved ESD protection for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Integrated circuit package with improved power signal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Integrated circuit package with improved power signal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Integrated circuit package with integral leadframe convector...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Integrated circuit package with internally readable permanent id

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Patent

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Integrated circuit package with low modulus layer and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Integrated circuit package with optimized mold shape

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Integrated circuit package with overlapping bond fingers

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Integrated circuit package with partially exposed contact...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Integrated circuit package with permanent identification of devi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Patent

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Integrated circuit package with removable shield

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Patent

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Integrated circuit package with top-side conduction cooling

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Integrated circuit package with via interconnections formed in a

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Integrated circuit package, and a method for producing an...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Integrated circuit package-in-package system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Integrated circuit package-in-package system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Integrated circuit package-in-package system and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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