Integrated circuit package with flat-topped heat sink

Details Integrated circuit package with flat-topped heat sink Integrated circuit package with flat-topped heat sink

1994-03-31

1995-10-24

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257706, H01L 2302

Patent

active

054612578

ABSTRACT:
An integrated circuit package is disclosed, of the type having a pin-fin heat sink attached to the surface. A flat plate is attached to the ends of the pins of the heat sink, to provide a planar surface area of adequate size to allow a vacuum pickup tool to pick and place the packaged integrated circuit, and to receive marking and symbolization.

REFERENCES:
patent: 4607277 (1986-08-01), Hassan et al.
patent: 4765400 (1988-08-01), Chu et al.
patent: 4770242 (1988-09-01), Daikoku et al.
patent: 4908695 (1990-03-01), Morihara et al.
patent: 5052481 (1991-10-01), Horvath et al.
patent: 5113315 (1992-05-01), Capp et al.
patent: 5345107 (1994-09-01), Diakoku et al.

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