Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2010-04-30
2011-11-01
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE25006, C257SE25013, C257SE25018, C257SE25021, C257SE25027, C257SE23085, C438S109000
Reexamination Certificate
active
08049322
ABSTRACT:
A method for making an integrated circuit package-in-package system includes: forming a first integrated circuit package including a first device and a first substrate and having a first interface; stacking a second integrated circuit package including a second device and a second substrate and having a second interface above the first integrated circuit package; and fitting the first interface directly on the second interface.
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Ha Jong-Woo
Kwon Hyeog Chan
Yim Choong Bin
Clark Jasmine
Ishimaru Mikio
Stats Chippac Ltd.
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