Integrated circuit package with top-side conduction cooling

Details Integrated circuit package with top-side conduction cooling Integrated circuit package with top-side conduction cooling

2007-03-23

2009-12-22

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S705000, C257S706000, C257S707000, C257S710000, C257S713000, C257S720000, C257SE23102, C257SE23180, C257SE23188, C257SE23193

Reexamination Certificate

active

07635916

ABSTRACT:
An IC package that employs top-side conduction cooling. The IC package has a low thermal resistance between a substrate housed within the package and the lid of the package. Thermal resistance is decreased by increasing the conduction cross-sections laterally through the package and lid and vertically from the package into the lid. The lid may also be modified with an extended mesa portion that reduces the gap between the lid and the IC. A thermally conductive spacer may also be interposed between the IC and the lid. Also, the package housing body and lid may be made from high thermal conductivity materials having thermal conductivities of 50 W/mK or greater with matching CTE between the lid and the package.

REFERENCES:
patent: 6091146 (2000-07-01), Berkely et al.
patent: 6724080 (2004-04-01), Ooi et al.
patent: 6888238 (2005-05-01), Li
patent: 2006/0261467 (2006-11-01), Colgan et al.

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