Integrated circuit package-in-package system

Details Integrated circuit package-in-package system Integrated circuit package-in-package system

2006-08-04

2008-10-21

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S686000

Reexamination Certificate

active

07439620

ABSTRACT:
An integrated circuit package-in-package system is provided including forming an external interconnect having an upper portion and a lower portion; forming a packaged device; mounting an active device over the packaged device; connecting the active device to the packaged device and the upper portion; and molding the packaged device, the active device, and the upper portion.

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patent: 2006/0022315 (2006-02-01), Huang et al.

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