Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Patent
1995-12-29
1997-09-23
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
257 48, 257773, 361820, 324765, H01L 2312, H01L 2358
Patent
active
056708254
ABSTRACT:
An integrated circuit (IC) device package that includes permanent identification regarding the device characteristics, wherein the permanent identification are at or below the surface of the package and may indicate the operating frequency of an IC die within the package, as well as voltage requirements, etc.
REFERENCES:
patent: 5107523 (1992-04-01), Heaney et al.
patent: 5274337 (1993-12-01), Young et al.
patent: 5334857 (1994-08-01), Mennitt et al.
patent: 5351001 (1994-09-01), Kornrumpf et al.
patent: 5410163 (1995-04-01), Murakami
Brown David A.
Hyde John W.
Schwartz Abby M.
Intel Corporation
Ostrowski David
Thomas Tom
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