Integrated circuit package-in-package system

Details Integrated circuit package-in-package system Integrated circuit package-in-package system

2007-10-30

2007-10-30

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S686000, C257S777000, C257SE27137, C257SE27144, C257SE21161, C257SE25006, C257SE23013, C257SE25021, C257SE25027, C257SE23085, C438S109000, C438S110000

Reexamination Certificate

active

11276941

ABSTRACT:
An integrated circuit package-in-package system is provided forming a first integrated circuit package having a first interface, stacking a second integrated circuit package having a second interface above the first integrated circuit package, fitting the first interface and the second interface, and attaching a third integrated circuit package on the second integrated circuit package.

REFERENCES:
patent: 6936922 (2005-08-01), Park et al.
patent: 6946323 (2005-09-01), Heo
patent: 6967395 (2005-11-01), Glenn et al.
patent: 6972481 (2005-12-01), Karnezos
patent: 2004/0232559 (2004-11-01), Adelmann
patent: 2005/0010725 (2005-01-01), Eilert
patent: 2006/0006518 (2006-01-01), Bolken et al.
patent: 2006/0063283 (2006-03-01), Cobbley et al.
patent: 2006/0220206 (2006-10-01), Gerber et al.

Affiliated with

Also associated with

Rating

Integrated circuit package-in-package system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package-in-package system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package-in-package system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3902919