Integrated circuit package with permanent identification of devi

Details Integrated circuit package with permanent identification of devi Integrated circuit package with permanent identification of devi

1995-09-29

1997-11-11

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Outside periphery of package having specified shape or...

257 48, 257273, 361820, 324765, H01L 2312, H01L 2358

Patent

active

056867590

ABSTRACT:
An integrated circuit (IC) device package that includes permanent identification regarding the device characteristics, wherein the permanent identification are at or below the surface of the package and may indicate the operating frequency of an IC die within the package, as well as voltage requirements, etc.

REFERENCES:
patent: 5107523 (1992-04-01), Heaney et al.
patent: 5274337 (1993-12-01), Young et al.
patent: 5334857 (1994-08-01), Mennitt et al.
patent: 5351001 (1994-09-01), Kornrumpf et al.
patent: 5410163 (1995-04-01), Murakami

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