Integrated circuit package with low modulus layer and...

Details Integrated circuit package with low modulus layer and... Integrated circuit package with low modulus layer and...

2006-05-09

2006-05-09

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S778000, C438S109000

Reexamination Certificate

active

07042077

ABSTRACT:
A system may include a coreless substrate, a layer of material attached to the substrate, the layer of material having a lower elastic modulus than the substrate, an interposer coupled to the layer of material, and a capacitive layer coupled to the interposer.

REFERENCES:
patent: 5177594 (1993-01-01), Chance et al.
patent: 5239448 (1993-08-01), Perkins et al.
patent: 6734540 (2004-05-01), Fritz

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