Integrated circuit package with overlapping bond fingers

Details Integrated circuit package with overlapping bond fingers Integrated circuit package with overlapping bond fingers

2005-10-18

2005-10-18

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S701000, C257S758000, C257S691000, C257S698000, C257S696000, C257S784000, C257S786000, C257S774000, C257S680000, C257S773000, C257S782000, C361S794000, C361S777000, C361S780000

Reexamination Certificate

active

06956286

ABSTRACT:
An integrated circuit package comprises a set of bond fingers for connecting wire bonds from the chip, the bond fingers being placed overlapping on a transverse axis from the chip and extending inwardly and outwardly from vias positioned at different positions along the transverse axis, so that wire bonds connected to adjacent fingers have the same length.

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