Integrated circuit package with improved power signal...

Details Integrated circuit package with improved power signal... Integrated circuit package with improved power signal...

2007-02-27

2007-02-27

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S723000, C257S691000, C257S697000, C257SE23169

Reexamination Certificate

active

10831795

ABSTRACT:
An integrated circuit (IC) package includes a substrate and an IC die mounted on a first side of the substrate. The IC package also includes a plurality of capacitors mounted on a second side of the substrate. The second side is opposite to the first side. The IC package further includes a plurality of conductive contact pads formed on the second side of the substrate and interspersed among the capacitors. Other embodiments are described and claimed.

REFERENCES:
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patent: 5798567 (1998-08-01), Kelly et al.
patent: 6330164 (2001-12-01), Khandros et al.
patent: 6535398 (2003-03-01), Moresco
patent: 2002/0017700 (2002-02-01), Mori et al.
patent: 2003/0110452 (2003-06-01), Leahy et al.
patent: 2003/0198033 (2003-10-01), Panella et al.
patent: 2003/0218235 (2003-11-01), Searls et al.
patent: 2004/0012085 (2004-01-01), Shioga et al.
“PCT Notification of Transmittal of the International Search Report”, mailed Jul. 27, 2005, for PCT/US2005/012072.

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