LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Electronic package having a thermal stretching layer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Electronic package having integrated cooling element with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Electronic package method and structure with cure-melt...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Electronic package structure and the packaging process thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Electronic package substrate with an upper dielectric layer...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Electronic package utilizing protective coating

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Portion of housing of specific materials

Electronic package with bonded structure and method of making

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Electronic package with compressible heatsink structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Electronic package with heat transfer means

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Electronic package with improved thermal properties

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Electronic package with lead wire connections

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Electronic package with offset reference plane cutout

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Electronic package with reduced bending stress

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Electronic package with snap-on perimeter wall

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

Electronic package with stress relief channel

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Electronic package with thermally conductive support member havi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Electronic package with thermally conductive support member havi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Electronic package with thermally conductive support member havi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Electronic package with thermally-enhanced lid