Electronic package with snap-on perimeter wall

Details Electronic package with snap-on perimeter wall Electronic package with snap-on perimeter wall

2006-08-15

2006-08-15

Lee, Eddie C. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S684000, C257S099000, C257S100000, C257S733000, C257S687000, C257S727000, C257S728000, C257S731000, C257S730000, C257S098000, C362S255000

Reexamination Certificate

active

07091582

ABSTRACT:
A semiconductor device package comprises a perimeter wall snap fitted to a base having a semiconductor die mounted on the base. A lead is mounted on the opposite side of the die, and the die and a portion of the lead are protected by an encapsulant disposed within the perimeter wall.

REFERENCES:
patent: 5005069 (1991-04-01), Wasmer et al.
patent: 5838703 (1998-11-01), Lebby et al.
patent: 5886403 (1999-03-01), Yoshinaga et al.
patent: 6060776 (2000-05-01), Spitz et al.
patent: 6541800 (2003-04-01), Barnett et al.
patent: 6821613 (2004-11-01), Kagi et al.

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