Electronic package with thermally-enhanced lid

Details Electronic package with thermally-enhanced lid Electronic package with thermally-enhanced lid

2007-02-27

2007-02-27

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S713000, C257S712000, C257S675000, C257SE23080, C257SE23101

Reexamination Certificate

active

10241994

ABSTRACT:
Removing heat generated by an operating IC chip from both the chip and the electronics package containing the chip is essential for proper system operation and to increase the life of the electronics package. Using an air permeable lid with the electronic package increases the heat transfer away from the IC chip and electronics package, thereby cooling the chip and the package.

REFERENCES:
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patent: 5585671 (1996-12-01), Nagesh et al.
patent: 5742007 (1998-04-01), Kornowski et al.
patent: 6091603 (2000-07-01), Daves et al.
patent: 6294408 (2001-09-01), Edwards et al.
patent: 6409859 (2002-06-01), Chung
patent: 6501171 (2002-12-01), Farquhar et al.
patent: 6512295 (2003-01-01), Gaynes et al.
patent: 6742007 (2004-05-01), Oshiama et al.
patent: 2002/0113306 (2002-08-01), Kwon et al.
patent: 10-041444 (1998-02-01), None

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