Electronic package method and structure with cure-melt...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

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C257SE23101

Reexamination Certificate

active

07834442

ABSTRACT:
Disclosed herein are embodiments of electronic package incorporating a thermal interface material (e.g., a metal TIM) that is positioned between a lid and a chip on a substrate. The TIM has a predetermined (i.e., repeatable) minimum thickness and is further registered to the top surface of the chip (i.e., the TIM has an essentially symmetric shape and does not extend vertically along the sidewalls of the chip). Also, disclosed herein are embodiments of a method of forming such an electronic package that uses a hierarchical heating process that cures a lid sealant, thereby securing the lid to the substrate, and then reflows (i.e., melts and cools) the TIM, thereby adhering the TIM to both the chip and lid. This hierarchical heating process ensures that the TIM has the above-mentioned characteristics (i.e., a predetermined minimum thickness and registration to the top surface of the chip) and further provides robust process windows for high-yield, low-cost electronic package manufacturing.

REFERENCES:
patent: 4034468 (1977-07-01), Koopman
patent: 4034469 (1977-07-01), Koopman et al.
patent: 4081825 (1978-03-01), Koopman et al.
patent: 4115619 (1978-09-01), Kurfman et al.
patent: 4193530 (1980-03-01), Holmes
patent: 4211822 (1980-07-01), Kurfman et al.
patent: 4453104 (1984-06-01), Rapps et al.
patent: 4524497 (1985-06-01), Rapps et al.
patent: 5072331 (1991-12-01), Thiele et al.
patent: 5097387 (1992-03-01), Griffith
patent: 5154341 (1992-10-01), Melton et al.
patent: 5233504 (1993-08-01), Melton et al.
patent: 5325265 (1994-06-01), Turlik et al.
patent: 5413489 (1995-05-01), Switky
patent: 5621225 (1997-04-01), Shieh et al.
patent: 5652466 (1997-07-01), Hirakawa et al.
patent: 5780321 (1998-07-01), Shieh et al.
patent: 5812571 (1998-09-01), Peters
patent: 5827102 (1998-10-01), Watkins et al.
patent: 5856858 (1999-01-01), Carey et al.
patent: 5900673 (1999-05-01), Nishi et al.
patent: 5909160 (1999-06-01), Dick et al.
patent: 5923086 (1999-07-01), Winer et al.
patent: 5940683 (1999-08-01), Holm et al.
patent: 6045030 (2000-04-01), Ramer et al.
patent: 6063506 (2000-05-01), Andricacos et al.
patent: 6090710 (2000-07-01), Andricacos et al.
patent: 6211463 (2001-04-01), Fabis
patent: 6259159 (2001-07-01), Dalal et al.
patent: 6294408 (2001-09-01), Edwards et al.
patent: 6344234 (2002-02-01), Dalal et al.
patent: 6442304 (2002-08-01), Crawley et al.
patent: 6461891 (2002-10-01), Dishongh et al.
patent: 6504242 (2003-01-01), Deppisch et al.
patent: 6630783 (2003-10-01), Ono
patent: 6653741 (2003-11-01), Sreeram et al.
patent: 6670599 (2003-12-01), Wagner et al.
patent: 6710369 (2004-03-01), Travis
patent: 6793829 (2004-09-01), Platt et al.
patent: 6879014 (2005-04-01), Wagner et al.
patent: 6882043 (2005-04-01), Dishongh et al.
patent: 7005667 (2006-02-01), Chen et al.
patent: 7005787 (2006-02-01), Hsiao et al.
patent: 7061086 (2006-06-01), Ferreiro et al.
patent: 7111771 (2006-09-01), Hua
patent: 7132721 (2006-11-01), Platt et al.
patent: 7148560 (2006-12-01), Lee et al.
patent: 7678615 (2010-03-01), Touzelbaev et al.
patent: 2006/0261467 (2006-11-01), Colgan et al.
patent: 2007/0175621 (2007-08-01), Datta et al.
patent: 2007/0184582 (2007-08-01), Nakamura et al.
patent: 2008/0242002 (2008-10-01), Colgan et al.
patent: 2009/0001557 (2009-01-01), Renavikar et al.
patent: 2009/0057884 (2009-03-01), Too et al.

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