Electronic package with compressible heatsink structure

Details Electronic package with compressible heatsink structure Electronic package with compressible heatsink structure

1996-12-16

1998-07-28

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257719, 257706, 257778, 257779, H01L 2334, H01L 2310

Patent

active

057866350

ABSTRACT:
An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.

REFERENCES:
patent: 4034468 (1977-07-01), Koopman
patent: 4254431 (1981-03-01), Babuka et al.
patent: 4770242 (1988-09-01), Daikoku et al.
patent: 4825284 (1989-04-01), Soga et al.
patent: 4993482 (1991-02-01), Dolbear et al.
patent: 5088007 (1992-02-01), Missele
patent: 5444300 (1995-08-01), Sato et al.
patent: 5474458 (1995-12-01), Vafi et al.
"Encapsulation Schemes For C4-Bonded Tab Packages", pp. 205-207, IBM TDB.
Research Disclosure, .A Thermally Enhanced Multichip Thin-Film Module., Aug., 1992, No. 340.

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