Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1994-01-25
1995-08-22
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257668, 257676, 257692, 257696, H01L 2302, H01L 2312, H01L 2348
Patent
active
054442990
ABSTRACT:
An electronic package assembly wherein lead wires serve to connect conductors on a first substrate (e.g., ceramic) having a semiconductor device (e.g., IC chip) coupled to the conductors and positioned on the substrate, to respective conductors on a second substrate (e.g., a printed circuit board). The lead wires are secured to three different surfaces (e.g., top, side and bottom) of the first substrate, and include curved projection portions for being directly connected to the second substrate conductors.
REFERENCES:
patent: 4819041 (1989-04-01), Redmond
patent: 5228862 (1993-07-01), Baumberger et al.
IBM Technical Disclosure Bulletin, vol. 30, No. 3, Aug. 1987, "Surface Solder Package", pp. 1240-1241, S. R. Engle et al.
Kobayakawa Yasukazu
Maeda Yoji
Tsuchita Shuhei
Tsukada Yutaka
Crane Sara W.
Fraley Lawrence R.
International Business Machines - Corporation
Jr. Carl Whitehead
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