Electronic package with thermally conductive support member havi

Details Electronic package with thermally conductive support member havi Electronic package with thermally conductive support member havi

1997-03-03

1998-06-30

Arroyo, Teresa Maria

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257706, 257737, 361707, 361749, H01L 2310, H01L 2334

Patent

active

057738840

ABSTRACT:
An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

REFERENCES:
patent: 4649418 (1987-03-01), Uden
patent: 4992850 (1991-02-01), Corbett et al.
patent: 5023202 (1991-06-01), Long et al.
patent: 5032543 (1991-07-01), Black et al.
patent: 5045921 (1991-09-01), Lin
patent: 5095404 (1992-03-01), Chao
patent: 5114880 (1992-05-01), Lin
patent: 5133118 (1992-07-01), Lindblad et al.
patent: 5168430 (1992-12-01), Nitsch et al.
patent: 5278724 (1994-01-01), Angulas et al.
Research Disclosure, Feb. 1991, No. 322, "Wire Bonded Chips Mounted to Dynamic Flex Cables (Directly on Stiffener)", Author Anonymous.
"Card Assembly Implications in Using the TBGA Module", May 18, 1993, P. Mescher.
"Area Array Tab Package Technology", Feb. 2-5, 1993, Fifth International TAB/Advanced Packaging Symposium, San Jose, CA, F. Andros & R. Hammer.
IBM Technical Disclosure Bulletin, vol. 31, No. 8, Jan., 1989, pp. 135-138, "Thin Film Module", by Chen et al.

Affiliated with

Also associated with

Rating

Electronic package with thermally conductive support member havi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic package with thermally conductive support member havi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic package with thermally conductive support member havi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1862948