Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-06-20
2006-06-20
Schillinger, Laura M. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S712000, C257S706000
Reexamination Certificate
active
07064429
ABSTRACT:
An electronic component includes at least one semiconductor chip. The semiconductor chip is attached on a first side of a wiring board or a leadframe. The wiring board is provided with interconnect structures at least on a second side. The first side of the wiring board, with the semiconductor chip located on it, is completely enclosed by a package. The package is provided with a cooling element, which is an integral part of the package. The invention also relates to a method for producing the electronic component.
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Bemmerl Thomas
Waidhas Bernd
Wörner Holger
Greenberg Laurence A.
Infineon - Technologies AG
Locher Ralph E.
Schillinger Laura M.
Stemer Werner H.
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