Electronic package with thermally conductive support member havi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

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Details

257706, 361719, 361720, H01L 2310, H01L 2334

Patent

active

055613233

ABSTRACT:
An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

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"Area Array Tab Package Technology", Feb. 2-5, 1993, Fifth International TAB/Advanced Packaging Symposium, San Jose, CA, F. Andros & R. Hammer.

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