Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1995-07-26
1996-10-01
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257706, 361719, 361720, H01L 2310, H01L 2334
Patent
active
055613233
ABSTRACT:
An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.
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Andros Frank E.
Bupp James R.
DiPietro Michael
Hammer Richard B.
Arroyo T. M.
Crane Sara W.
Fraley Lawrence R.
International Business Machines - Corporation
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