Electronic package with improved thermal properties

Details Electronic package with improved thermal properties Electronic package with improved thermal properties

1995-07-03

1997-07-22

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257675, 257710, 257787, 257796, H01L 2310, H01L 2334

Patent

active

056506635

ABSTRACT:
An electronic package having improved thermal performance. In the case of a plastic package, the inner ends of the leads of the lead frame are attached to a heat slug by a high thermal conductivity material such as solder or a polymeric material. In the case of a metal package, the inner ends of the leads of the leadframe are attached to the metal base component by a high thermal conductivity material.

REFERENCES:
patent: 3702427 (1972-11-01), Learn et al.
patent: 4495378 (1985-01-01), Dotzer et al.
patent: 4577056 (1986-03-01), Butt
patent: 4939316 (1990-07-01), Mahulikar et al.
patent: 4967260 (1990-10-01), Butt
patent: 5013871 (1991-05-01), Mahulikar et al.
patent: 5025114 (1991-06-01), Braden
patent: 5034591 (1991-07-01), Fang
patent: 5132773 (1992-07-01), Braden et al.
patent: 5367196 (1994-11-01), Mahulikar et al.

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