LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Die-up integrated circuit package with grounded stiffener

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Die-up tape ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Die-warpage compensation structures for thinned-die devices,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Dielectric composite material

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Dielectric film for printed wiring board, multilayer printed...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Dielectric layer structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Differential pair geometry for integrated circuit chip packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...

Diffusion-based method and apparatus for determining circuit int

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Digital signal processing assembly and test method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Digital signal processor/known good die packaging using...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...

Diode with electrodes and case assembled without soldering or cr

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Direct alignment of contacts

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Direct attach chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Direct bonded heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Direct bonding of small parts and module of combined small...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...

Direct build-up layer on an encapsulated die package having...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount

Direct contact die attach

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Direct contact semiconductor cooling

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Direct contact through hole type wafer structure