Direct contact die attach

Details Direct contact die attach Direct contact die attach

1996-12-20

1999-03-02

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With housing mount

257664, 257727, 257728, 257785, 257676, H01L 2312

Patent

active

058775552

ABSTRACT:
A semiconductor die is attached to a transistor package by a plurality of resilient clamping members, which are bonded at one end to a top surface of the semiconductor die and at another end to a stable surface, such as an emitter, collector, or base lead frame, of the transistor package. The shape and composition of the clamping members provides a resilient force that causes a bottom surface of the die to make and maintain substantially uniform and constant contact with the die attach area of the transistor package, e.g., a mounting flange or non-conductive substrate. The clamping members are preferably conductive and can conduct current from respective transistor cell locations on the die to the respective lead frames to which the clamping members are bonded.

REFERENCES:
patent: 3614832 (1971-10-01), Chance et al.
patent: 3842189 (1974-10-01), Southgate
patent: 3962669 (1976-06-01), Entine et al.
patent: 5130783 (1992-07-01), McLellan
patent: 5138434 (1992-08-01), Wood et al.
patent: 5237203 (1993-08-01), Massaron
patent: 5331513 (1994-07-01), Hirai et al.
patent: 5389819 (1995-02-01), Matsuoka
patent: 5578879 (1996-11-01), Farnsworth et al.
patent: 5663596 (1997-09-01), Little
Formikell et al, `Leaf Spring Contractor Assembly` IBM Tech. Dis. Bull. vol. 17 No. 3 pp. 651-652, Aug. 1974.
B.E. Hart et al.: "Low-inductance Transistor", IBM Technical Disclosure Bulletin, vol. 14, No. 3, Aug. 1971, New York, pp. 706-707, XP002063488, see p. 707, paragraph 2-4.

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