Diode with electrodes and case assembled without soldering or cr

Details Diode with electrodes and case assembled without soldering or cr Diode with electrodes and case assembled without soldering or cr

1991-08-02

1993-04-27

Thompson, Gregory D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With large area flexible electrodes in press contact with...

361388, 361386, 257699, 257719, H05K 720

Patent

active

052067939

ABSTRACT:
A diode assembly having electrodes and a case assembled without soldering or crimping, wherein the electrodes are maintained connected to respective opposite faces of a diode chip by simple intimate contact of electrical and thermal conduction under the permanent action of a pressure exerted by an elastic element. The case is closed by a cover kept solidly in closing position by a simple wedging effect under a continuous thrust exerted by the elastic element.

REFERENCES:
patent: 3662231 (1972-05-01), Goodacre
patent: 4224663 (1980-09-01), Maiese et al.
patent: 4305087 (1981-12-01), Wislocky
patent: 4670678 (1987-06-01), Jager et al.

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