Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-01-16
2007-01-16
Wilczewski, M. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S702000, C257S759000, C257S760000, C257S762000
Reexamination Certificate
active
10465155
ABSTRACT:
A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.
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Clough Robert S.
Li Fuming B.
Mao Guoping
O'Bryan Nelson B.
Qu Shichun
3M Innovative Properties Company
Gover Melanie G.
Wilczewski M.
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