Dielectric composite material

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S702000, C257S759000, C257S760000, C257S762000

Reexamination Certificate

active

10465155

ABSTRACT:
A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.

REFERENCES:
patent: 5126192 (1992-06-01), Chellis et al.
patent: 5378927 (1995-01-01), McAllister et al.
patent: 5492552 (1996-02-01), Cronk et al.
patent: 5844170 (1998-12-01), Chor et al.
patent: 5946600 (1999-08-01), Hurwitz et al.
patent: 6021564 (2000-02-01), Hanson
patent: 6091466 (2000-07-01), Kim et al.
patent: 6143401 (2000-11-01), Fischer et al.
patent: 6184284 (2001-02-01), Stokich et al.
patent: 6262376 (2001-07-01), Hurwitz et al.
patent: 6262478 (2001-07-01), Hurwitz et al.
patent: 6280640 (2001-08-01), Hurwitz et al.
patent: 6288188 (2001-09-01), Godschalx et al.
patent: 6310368 (2001-10-01), Yagura
patent: 6346296 (2002-02-01), McCarthy et al.
patent: 6361926 (2002-03-01), So et al.
patent: 6388890 (2002-05-01), Kwong et al.
patent: 6410414 (2002-06-01), Lee
patent: 6420093 (2002-07-01), Ohba et al.
patent: 6455880 (2002-09-01), Ono et al.
patent: 6528145 (2003-03-01), Berger et al.
patent: 6544638 (2003-04-01), Fischer et al.
patent: 2002/0102494 (2002-08-01), Ohba et al.
patent: 2003/0069349 (2003-04-01), Sumita et al.
patent: 2004/0148766 (2004-08-01), Noguchi et al.
patent: 0 616 701 (2002-02-01), None
patent: WO 90/06960 (1990-06-01), None
patent: WO 96/31805 (1996-10-01), None
patent: WO 01/58230 (2001-08-01), None
patent: WO 02/16477 (2002-02-01), None
Phil Garrou, et al., “High Frequency/High Density Build-up Boards with Benzocyclobutene(BCB)Polymer Coated Cu Foil”, 2000 IEEE, 2000 Electronic Components and Technology Conference, pp. 1647-1651.
Ying-Hung So, et al., “Benzocyclobutene(BCB)Based Polymers for Microelectronic Applications”, Abstracts of Papers of the American Chemical Society, 2002, vol. 224, 2, Aug. 18, 2002, p. U496, 14 pages.
Tadanori Shimoto, et al., “High Density Multilayer Substrate Using Benzocyclobutene Dielectric”, IMC 1992 Proceedings, Yokohama, Japan, Jun. 3-Jun. 5, 1992, pp. 325-330.
Jeffrey M. Snodgrass, et al., “The effect of Fatigue on the Adhesion and Subcritical Debonding of Benzocyclobutene/Silicon Dioxide Interfaces”, Material Research Society Symposium Proceedings, vol. 612 © 2000 Materials Research Society, pp. D1.3.1-D.1.3.6.
N. Yasmeen et al., “Benzocyclobutene/Copper Reliability Study”, Electrochemical Society Proceedings vol. 98-3, pp. 299-312.
P. Pieters et al., “High-Q Inductors for Realization of Low Insertion Loss Baluns and Couplers Integrated in Thin Film Multilayer MCM-D Technology for Wireless Applications”, 30thEuropean Microwave Conference—Paris 2000, pp. 60-63.
X. Sun et al., “Analysis of High-Q On-Chip Inductors Realized by Wafer-Level Packaging Techniques”, 2003 Electronic Components and Technology Conference, pp. 1510-1515.
Maura Jenkins et al., “Studies of Silane Adhesion Promoters on Silica Filler Particles for use in Microelectronic Packaging”, Mat. Res. Soc. Symp. Proc. vol. 710, copyright 2002 Materials Research Society, pp. DD10.10.1-DD10.10.6.
Percy B. Chinoy et al., “Processing and Microwave Characterization of Multilevel Interconnects Using Benzocyclobutene Dielectric”, IEEE Transactions on Components, Hybrids and Manufacturing Technology, Nov. 16, 1993, No. 7, New York, US, pp. 714-719.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Dielectric composite material does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dielectric composite material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dielectric composite material will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3728390

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.