Die-warpage compensation structures for thinned-die devices,...

Details Die-warpage compensation structures for thinned-die devices,... Die-warpage compensation structures for thinned-die devices,...

2009-06-18

2011-12-20

Chu, Chris (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257SE23108, C257S706000, C257S712000, C257S720000, C438S122000, C438S125000

Reexamination Certificate

active

08080870

ABSTRACT:
A back-side lamination (BSL) is applied after thinning a microelectronic die. The BSL is configured to be a thermal-expansion complementary structure to a metal wiring interconnect layout that is disposed on the active side of the microelectronic die.

REFERENCES:
patent: 6472762 (2002-10-01), Kutlu
patent: 6683386 (2004-01-01), Bai
patent: 6730998 (2004-05-01), Williams et al.
patent: 6897566 (2005-05-01), Su
patent: 7327041 (2008-02-01), Dotta et al.
patent: 7449780 (2008-11-01), Hua et al.
patent: 2005/0090026 (2005-04-01), Otaki

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