Direct bonded heat spreader

Details Direct bonded heat spreader Direct bonded heat spreader

1994-08-19

1997-07-22

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257701, 257712, 257713, 257717, H01L 2312

Patent

active

056506627

ABSTRACT:
A heat spreader formed of copper or copper alloys is direct bonded to an electronic device package which includes a multilayer substrate formed of alternating layers of ceramic and metallic plating.

REFERENCES:
patent: 4902854 (1990-02-01), Kaufman
patent: 5012386 (1991-04-01), McShane et al.

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