Direct attach chip scale package

Details Direct attach chip scale package Direct attach chip scale package

2005-05-31

2005-05-31

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S706000, C257S701000, C257S702000, C257S713000, C257S778000, C257S738000, C257S780000, C257S774000, C257S737000

Reexamination Certificate

active

06900534

ABSTRACT:
A reliable, chip scale or flip chip semiconductor device which can be directly attached to a PC board without the use of an underfill material to absorb stress on the solder joints interconnecting the device and board is provided by a silicon chip, having the substrate thinned until the chip thickness is in the range of 50 to 250 microns, attaching a backing or cap layer with specific thermal properties to approximate those of a printed circuit board (PCB), and providing solder bump contacts attached to the input/output terminals.

REFERENCES:
patent: 5273940 (1993-12-01), Sanders
patent: 5308980 (1994-05-01), Barton
patent: 5627405 (1997-05-01), Chillara
patent: 5814894 (1998-09-01), Igarashi et al.
patent: 5883430 (1999-03-01), Johnson
patent: 6023094 (2000-02-01), Kao et al.
patent: 6137164 (2000-10-01), Yew et al.
patent: 6380621 (2002-04-01), Ando et al.
patent: 0 203 591 (1986-03-01), None
patent: 04054668 (1993-08-01), None
patent: WO 00/11919 (2000-02-01), None

Affiliated with

Also associated with

Rating

Direct attach chip scale package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Direct attach chip scale package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Direct attach chip scale package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3432418