Direct contact semiconductor cooling

Details Direct contact semiconductor cooling Direct contact semiconductor cooling

2007-01-02

2007-01-02

Prenty, Mark V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C438S015000

Reexamination Certificate

active

10849097

ABSTRACT:
Thermal spreading resistance, associated with small geometry electronic features that generate heat on a semiconductor, may be reduced through the addition of a thermally conductive fluid. For example, a dielectric fluid may be used within a volume between a semiconductor package and the semiconductor substrate. Therefore, direct thermal cooling may be employed to reduce the thermal spreading resistance often encountered in MMIC power amplifier devices. Furthermore, exemplary methods to achieve this sealing are described herein.

REFERENCES:
patent: 4431579 (1984-02-01), Yasufuku et al.
patent: 4961106 (1990-10-01), Butt et al.
patent: 5305184 (1994-04-01), Andresen et al.
patent: 5455458 (1995-10-01), Quon et al.
patent: 5625227 (1997-04-01), Estes et al.
patent: 6771500 (2004-08-01), Siegel et al.
patent: 6937471 (2005-08-01), Haws et al.
patent: 53 135579 (1978-11-01), None
patent: 60 254641 (1985-12-01), None
patent: 61-2350 (1986-01-01), None
patent: WO 95/27308 (1995-10-01), None

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