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Chip package with capacitor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Chip package with degassing holes

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With means to prevent explosion of package
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Chip package with die and substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Chip package with die and substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Chip package with embedded component

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Chip package with grease heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Chip package with grease heat sink and method of making

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Chip package, method of making same and digital camera...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Chip packaging and connection for reduced EMI

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Chip packaging structure without leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Chip packaging system and method using deposited diamond film

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Chip packaging technique

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Chip scale ball grid array for integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Chip scale electrical test fixture with isolation plate...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping
Reexamination Certificate

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Chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Chip scale package in which layout of wiring lines is improved

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Chip scale package type of semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Chip scale packages manufactured at wafer level

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Chip scale packages performed by wafer level processing

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Chip scale packaging with improved heat dissipation capability

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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