Chip packaging structure without leadframe

Details Chip packaging structure without leadframe Chip packaging structure without leadframe

2007-09-25

2007-09-25

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S737000, C257S784000, C257S786000, C257SE23068

Reexamination Certificate

active

11195655

ABSTRACT:
A chip packaging structure without leadframe includes a bare chip having one surface provided with a plurality of contacts, and an adhesive and a fixing layer sequentially attached to the surface of the bare chip with the contacts, and a plurality of lead wires sandwiched between the adhesive and the fixing layer. Each of the lead wires has an inner end electrically connected to one of the contacts on the bare chip via an inner connecting window area provided on the adhesive layer corresponding to the contacts on the bare chip, and an outer end extended to one of multiple outer connecting window areas provided on the fixing layer to electrically connect to one of many external conducting bodies implanted in and exposed from the outer connecting window areas, such that no leadframe is needed to enable further reduced volume and decreased packaging cost of the whole chip packaging structure.

REFERENCES:
patent: 5990546 (1999-11-01), Igarashi et al.
patent: 6181569 (2001-01-01), Chakravorty

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