Chip scale ball grid array for integrated circuit package

Details Chip scale ball grid array for integrated circuit package Chip scale ball grid array for integrated circuit package

1996-12-02

1999-11-23

Kelley, Nathan K.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257778, 257678, H01L 2348

Patent

active

059905450

ABSTRACT:
A chip scale ball grid array for integrated circuit packaging having a nonpolymer layer or support structure positioned between a semiconductor die and a substrate. The nonpolymer support structure acts to increase circuit reliability by reducing thermal stress effects and/or by reducing or eliminating formation of voids in an integrated circuit package. A nonpolymer support structure may be a material, such as copper foil, having sufficient rigidity to allow processing of chip scale package in strip format.

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