Chip scale package type of semiconductor device

Details Chip scale package type of semiconductor device Chip scale package type of semiconductor device

1995-12-29

1999-11-23

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257737, 257778, 257787, H01L 23053

Patent

active

059905468

ABSTRACT:
A semiconductor device in which the space between a semiconductor chip and an auxiliary wiring plate is sealed with resin. The auxiliary wiring plate has insulating layers and on both sides of the routing conductor, the insulating layer on the side of the semiconductor chip has a hole being led from the routing conductor to the electrode of the semiconductor chip, the metal filled in the hole and the metal bump formed so as to protrude from the hole serves as an inner electrode. The semiconductor device can be manufactured by the TAB technique.

REFERENCES:
patent: 5222014 (1993-06-01), Lin
patent: 5311059 (1994-05-01), Baneri et al.
patent: 5450283 (1995-09-01), Lin et al.
patent: 5535101 (1996-07-01), Miles et al.

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