Chip package, method of making same and digital camera...

Details Chip package, method of making same and digital camera... Chip package, method of making same and digital camera...

2007-04-02

2009-12-29

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S680000, C257S773000, C257S783000, C257S784000, C257SE23013, C257S098000, C257S099000, C257S100000, C438S106000, C438S107000, C438S025000, C438S026000, C438S027000

Reexamination Certificate

active

07638864

ABSTRACT:
A digital camera module (100) includes a chip package (110) and a lens module (130), mounted on the chip package, for forming a focused image on the chip package. The chip package includes a supporter (112), a chip (114), a plurality of wires (116), a main adhesive (118), and a cover plate (119). The supporter includes a through hole defined therethrough and has a plurality of top contacts (1130) formed thereon around the through hole. The chip is disposed in the through hole and includes a plurality of pads (1144) arranged thereon. The wires electrically connect the pads to the top contacts. The main adhesive is applied to a gap between the chip and the supporter and fixes the chip to the supporter. The cover plate is adhered and supported on the main adhesive. A method for making the chip package is also provided.

REFERENCES:
patent: 5865935 (1999-02-01), Ozimek et al.
patent: 6388340 (2002-05-01), Distefano
patent: 7453509 (2008-11-01), Losehand et al.
patent: 2006/0093352 (2006-05-01), Webster et al.
patent: 2-105443 (1990-04-01), None

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