Chip package with embedded component

Details Chip package with embedded component Chip package with embedded component

2007-06-12

2007-06-12

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257SE23179, C257SE25013, C257SE23101, C257SE23178, C257SE25012, C257SE23140, C257SE23068, C257SE23062, C257SE23067, C257SE23077, C257SE23176, C257SE23106, C257S691000, C257S692000, C257S698000, C257S203000, C257S207000, C257S208000, C257S211000, C257S797000, C257S706000, C257S778000, C257S712000, C174S260000, C174S258000, C361S762000, C361S764000, C361S761000, C361S719000, C361S704000, C165S080300, C165S185000

Reexamination Certificate

active

11111303

ABSTRACT:
A chip package is provided. The chip package includes at least one chip, an interconnection structure, a plurality of second pads and at least one panel-shaped component, wherein the chip includes a plurality of first pads on a surface thereof. The interconnection structure is disposed on the chip, and the first pads of the chip are electrically coupled to the interconnection structure. The second pads are disposed on the interconnection structure, and the panel-shaped component is embedded in the interconnection structure. The panel-shaped component also includes a plurality of electrodes on its two opposite surfaces, and the second pads are electrically coupled to the first pads of the chip through the interconnection structure and the panel-shaped component.

REFERENCES:
patent: 6507119 (2003-01-01), Huang et al.
patent: 6555906 (2003-04-01), Towle et al.
patent: 7045391 (2006-05-01), Lin
patent: 7050304 (2006-05-01), Hsu et al.
patent: 7170162 (2007-01-01), Chang
patent: 2003/0047809 (2003-03-01), Takeuchi et al.
patent: 2003/0227077 (2003-12-01), Towle et al.
patent: 2004/0082100 (2004-04-01), Tsukahara et al.
patent: 2004/0227258 (2004-11-01), Nakatani
patent: 2005/0056942 (2005-03-01), Pogge et al.
patent: 2005/0211465 (2005-09-01), Sunohara et al.
patent: 2005/0253244 (2005-11-01), Chang
patent: 2005/0269687 (2005-12-01), Forcier
patent: 2006/0014327 (2006-01-01), Cho et al.
patent: 2006/0105500 (2006-05-01), Chang

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