Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2005-06-07
2005-06-07
Sarkar, Asok Kumar (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S792000
Reexamination Certificate
active
06903451
ABSTRACT:
In accordance with the present invention, a chip scale package (CSP) is manufactured at wafer-level. The CSP includes a chip, a conductor layer for redistribution of the chip pads of the chip, one or two insulation layers and multiple bumps, which are interconnected to respective chip pads by the conductor layer and are the terminals of the CSP. In addition, in order to improve the reliability of the CSP, a reinforcing layer, an edge protection layer and a chip protection layer are provided. The reinforcing layer absorbs stress applied to the bumps when the CSP is mounted on a circuit board and used for an extended period, and extends the life of the bumps, and thus, the life of the CSP. The edge protection layer and the chip protection layer prevent external force from damaging the CSP. After forming all elements constituting the CSP on the semiconductor wafer, the semiconductor wafer is sawed to produce individual CSPs.
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Jang Dong Hyeon
Kang Sa Yoon
Kim Nam Seog
Kwon Heung Kyu
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