LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Bottom lead semiconductor package having folded leads

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Bow control in an electronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Bow control in an electronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Bridge connection type of chip package and fabricating...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Bridge stack integrated circuit package system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Bridges for interconnecting interposers in multi-chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...

Buffer with drive characteristics controllable by software

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Build-up board package for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Bump bonding and sealing a semiconductor device with solder

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Bump chip scale semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Bumped chip carrier package using lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Bumped integrated circuits for optical applications

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Bumping technology in stacked die configurations

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Bumpless assembly package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Bumpless chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Bumpless chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Buried array capacitor and microelectronic structure...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Buried ground plane for high performance system modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Bypass capacitor embedded flip chip package lid and stiffener