Bump chip scale semiconductor package

Details Bump chip scale semiconductor package Bump chip scale semiconductor package

1998-12-29

2000-07-18

Graybill, David E.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257738, 257778, 257781, H01L 2312, H01L 2348, H01L 2352, H01L 2940

Patent

active

060911417

ABSTRACT:
A bump chip scale semiconductor package. In the bump chip scale semiconductor package, the chip bumps are directly formed on the chip pads of a semiconductor chip. The above chip bumps are used as the signal input and output terminals of the package and are used as surface mounting joints when the chip is mounted to a mother board.

REFERENCES:
patent: 5391397 (1995-02-01), Mukerji
patent: 5585671 (1996-12-01), Nagesh et al.
patent: 5813115 (1998-09-01), Misawa et al.

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