Bridge stack integrated circuit package system

Details Bridge stack integrated circuit package system Bridge stack integrated circuit package system

2011-08-09

2011-08-09

Pham, Hoai v (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257SE25006, C438S109000

Reexamination Certificate

active

07994619

ABSTRACT:
An integrated circuit package system is provided including mounting a first device on a carrier, mounting a second device over the first device and the carrier in an offset face-to-face configuration, and connecting the first device and the second device at an overlap.

REFERENCES:
patent: 6661083 (2003-12-01), Lee et al.
patent: 7049687 (2006-05-01), Takahashi et al.
patent: 7061105 (2006-06-01), Masuda et al.
patent: 7061120 (2006-06-01), Shin et al.
patent: 7061125 (2006-06-01), Cho et al.
patent: 7078264 (2006-07-01), Yang
patent: 7098542 (2006-08-01), Hoang et al.

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