Bridges for interconnecting interposers in multi-chip...

Details Bridges for interconnecting interposers in multi-chip... Bridges for interconnecting interposers in multi-chip...

2011-08-30

2011-08-30

Wagner, Jenny L. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S778000, C257SE23085, C361S760000

Reexamination Certificate

active

08008764

ABSTRACT:
A structure and a method for forming the same. The structure includes a substrate, a first interposer on the substrate, a second interposer on the substrate, and a first bridge. The first and second interposers are electrically connected to the substrate. The first bridge is electrically connected to the first and second interposers.

REFERENCES:
patent: 5854507 (1998-12-01), Miremadi et al.
patent: 6477034 (2002-11-01), Chakravorty et al.
patent: 7554203 (2009-06-01), Zhou et al.
patent: 7589409 (2009-09-01), Gibson et al.

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