Bumpless chip package

Details Bumpless chip package Bumpless chip package

2008-04-22

2008-04-22

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S723000

Reexamination Certificate

active

11314787

ABSTRACT:
A bumpless chip package including at least a panel-shaped component, a chip, an interconnection structure and a conductive channel is provided. The chip is disposed on the panel-shaped component. The chip has a plurality of chip pads disposed on an active surface of the chip. The interconnection structure is disposed on the panel-shaped component and the chip. The interconnection structure has an inner circuit and a plurality of contact pads. The contact pads are disposed on a contact surface of the interconnection structure. At lease one chip pad is connected electrically to at least one contact pad by the inner circuit. The conductive channel extends from the active surface of the chip to a side surface thereof adjacent to the active surface. One end of the conductive channel is electrically connected to at least one chip pad and the other end thereof is electrically connected to the panel-shaped component.

REFERENCES:
patent: 5048179 (1991-09-01), Shindo et al.
patent: 6555906 (2003-04-01), Towle et al.
patent: 7074696 (2006-07-01), Frankowsky et al.

Affiliated with

Also associated with

Rating

Bumpless chip package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bumpless chip package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bumpless chip package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3913176