Bypass capacitor embedded flip chip package lid and stiffener

Details Bypass capacitor embedded flip chip package lid and stiffener Bypass capacitor embedded flip chip package lid and stiffener

2006-10-03

2006-10-03

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE33075, C257SE31131, C257SE23051, C257SE23080, C257SE23104, C257SE23181, C257S712000, C257S675000, C257S717000, C257S720000, C257S710000, C257S706000, C257S704000, C257S528000, C257S523000, C257S728000, C257S719000, C361S514000, C361S697000, C361S709000, C361S704000, C361S710000, C361S707000, C361S761000, C361S719000

Reexamination Certificate

active

07115988

ABSTRACT:
The present invention provides a heat spreader with a bypass capacitor to provide substantially instant power and/or to control simultaneous switching noise (SSN). The present invention also provides a semiconductor device package incorporating this heat spreader. In addition, fabrication methods for such heat spreaders and packages are provided. Generally, the heat spreaders and packages of the present invention include an embedded bypass capacitor that can provide decoupling capacitance in order to deliver near instant power to the die and/or minimize SSN. In a preferred embodiment, the embedded bypass capacitor is connected to terminals integrated with the heat spreader (e.g., lid; stiffener) and/or to a package plane (e.g., power plane or ground plane) in the package substrate for connection via the flip chip package's power delivery system to a power source and/or component.

REFERENCES:
patent: 5475565 (1995-12-01), Bhattacharyya et al.
patent: 5956226 (1999-09-01), Jung et al.
patent: 6212070 (2001-04-01), Atwood et al.
patent: 6225696 (2001-05-01), Hathaway et al.
patent: 6888235 (2005-05-01), Lopata et al.
patent: 55-91152 (1980-07-01), None

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