Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Patent
1994-05-16
1996-12-10
Mintel, William
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Entirely of metal except for feedthrough
257712, 257718, 257730, H01L 2310
Patent
active
055833780
ABSTRACT:
A ball grid array package and low cost method for manufacture of the same is disclosed herein. The ball grid array package includes a thermal conductor which is a linearly co-extensive outer layer of an interconnection substrate and forms the outer surface of the ball grid array package. An integrated circuit chip is positioned on the underside of the package in a well region. The well region is either formed directly in the interconnection substrate or is formed by the application of a dam. The well region is then filled with an insulating encapsulant material to a predetermined level.
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Marrs Robert C.
Molnar Ronald J.
Amkor Electronics, Inc.
MacPherson Alan H.
McKay Philip J.
Mintel William
Potter Roy
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