Ball grid array (BGA) semiconductor package member

Details Ball grid array (BGA) semiconductor package member Ball grid array (BGA) semiconductor package member

1998-01-21

2000-09-05

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

438111, H01L 2348, H01L 2144, H01L 2148, H01L 2150

Patent

active

061147605

ABSTRACT:
The present invention relates to a ball grid array (BGA) semiconductor package member and its manufacturing method employing a carrier frame and a substrate, and to a method of manufacturing a BGA semiconductor package using the BGA semiconductor package member. In manufacturing the conventional BGA semiconductor package, conventional package manufacturing equipment cannot be employed because a boat is used during processing which requires additional equipment, and thus increases the costs of production. However, a BGA semiconductor package manufacturing method employing a carrier frame and substrate according to the present invention is compatible with conventional semiconductor package manufacturing equipment. In other words, a BGA semiconductor package member is made by attaching a substrate having a multi-layer wiring therein onto a carrier frame having the same structure as a conventional lead frame, then a semiconductor chip is attached to the member and a wiring and molding processes are successively performed. The BGA semiconductor package manufacturing method according to the present invention allows computability with conventional manufacturing equipment, and automation and high speed processing of the overall manufacturing operation is achieved to thus minimize production costs and improve productivity.

REFERENCES:
patent: 4949161 (1990-08-01), Allen et al.
patent: 5570271 (1996-10-01), Lavochkin
patent: 5761044 (1998-06-01), Nakajima
patent: 5854741 (1998-12-01), Shim et al.
patent: 5859475 (1999-01-01), Freyman et al.
Assembly Process and Solder Joint Integrity of the Metal Ball Grid Array (MBGA.TM.) Package, S. Tostado et al., Olin Interconnect Technologies, 1996 Electronic Components and Technology Conference, pp. 1265-1270.

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