Ball grid array housing having a cooling foil

Details Ball grid array housing having a cooling foil Ball grid array housing having a cooling foil

2007-06-12

2008-08-19

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE23103, C257S707000, C257SE23130, C438S122000

Reexamination Certificate

active

07414311

ABSTRACT:
A ball grid array housing, a semiconductor device having a ball grid array housing and an electronic circuit are disclosed. In one embodiment, a ball grid array housing includes a substrate with solder ball connections pointing out from a housing and at least one semiconductor chip. For better heat dissipation from the housing, the ball grid includes a metallic cooling foil, or a metallic cooling plate. A method of making a ball grid array is also disclosed.

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